| 标题 |
Improved Approaches for FEA Analyses of PBGA Packages Subjected to Thermal Cycling |
| 网址 | |
| DOI |
10.1115/ipack2018-8398
doi
|
| 其它 |
期刊:ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者:Chienchih Chen; Jeffrey C. Suhling; Pradeep Lall 出版日期:2018-08-27 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)