| 标题 |
Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science & Technology 作者:Qiushi Kang; Ge Li; Zhengda Li; Yanhong Tian; Chenxi Wang 出版日期:2023-02-03 |
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(2025-6-4)