| 标题 |
Thermal Behavior in Vertically Stacked Cascode GaN HEMT Power Modules Including Mutual Heating, Dissipation Disturbance, and Solder Voids |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology 作者:Sungtaek Hwang; Eun Pyo Hong; Min-Ki Kim; Dong Keun Jang; S. Yoon 出版日期:2026-02-01 |
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(2025-6-4)