| 标题 |
Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation |
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| DOI | |
| 其它 |
期刊:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 作者:Y.C. Chen; K.N. Chiang 出版日期:2024-04-07 |
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(2025-6-4)