| 标题 |
(Invited) Thermal-Expansion Matched and CMOS Fab-Friendly Engineered Substrates Enabling Unmatched Cost, Performance & Application Scale for GaN Devices |
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| DOI | |
| 其它 |
期刊: 作者:V. Odnoblyudov 出版日期:2018-10-01 |
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(2025-6-4)