| 标题 |
Combined surface activated bonding (SAB) approach for SiO<inf>2</inf> direct wafer bonding in vacuum |
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| DOI | |
| 其它 |
期刊:2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) 作者:Ran He; Masahisa Fujino; Akira Yamauchi; Tadatomo Suga 出版日期:2015-05-23 |
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(2025-6-4)