Lv3
354 积分 2025-09-28 加入
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
2天前
已完结
Características inmunológicas claves en la fisiopatología de la sepsis. Infectio
2天前
已完结
(Invited) Modified SAB Methods for Hybrid and All-Cu Bonding for 3D Integration below 200ºC
9天前
已完结
Influence of Composition of SiCN Film for Surface Activated Bonding
20天前
已完结
Low temperature Si3N4 direct bonding
20天前
已完结
Interlayer Dielectric Bonding for 300mm Wafers
22天前
已关闭
Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding
22天前
已完结
Structural characterization and bonding energy analysis for plasma-activated bonding of SiCN films: A reactive molecular dynamics study
22天前
已关闭
Development of Polymer Base Hybrid Bonding Process
23天前
已完结
Mechanism of indium tin oxide//indium tin oxide direct wafer bonding
1个月前
已完结
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