| 标题 |
Flexible electronics substrate with excellent tear-resistant and high toughness using multi-material 3D printing |
| 网址 | |
| DOI | |
| 其它 |
期刊:Additive manufacturing 作者:Fei Wang; Zhenqiang Gao; Chang‐Ping Feng; Dan-Yang Wang; Mao-Peng Jin; et al 出版日期:2024-01-21 |
| 求助人 | |
| 下载 |
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(2025-6-4)