| 标题 |
Enhanced thermal management for vertically immersed high-power chips via micro-pillar structured surfaces |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Journal of Heat and Mass Transfer 作者:Yuhao Yan; Ying Liu; Longhuang Xiao; Jialiang Yang; Yongjie Lu; et al 出版日期:2026-12-01 |
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(2025-6-4)