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Experimental analysis of mismatch in electro-thermal device parameter within parallel connected SiC MOSFETs: Considerations for multi-chip power module design |
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期刊:2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) 作者:A. Fayyaz; Y. Li; Paul Evans; Alan Watson; Pat Wheeler; et al 出版日期:2023-08-27 |
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(2025-6-4)