| 标题 |
专利、报告等 High-Frequency Modeling and Optimization of Interconnects in Electronic Packaging
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| 网址 |
求助人暂未提供
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| DOI |
暂未提供,该求助的时间将会延长,查看原因?
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| 其它 |
I. Ndip and M. Töpper, "High-Frequency Modeling and Optimization of Interconnects in Electronic Packaging," in Professional Development Course (PDC) ECTC 2013, Las Vegas; NV; USA, 2013 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)