| 标题 |
A novel shock life model for BGA solder joints based on evolutionary power spectral density |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Journal of Fatigue 作者:Yongbin Dang; Zhiwei Hao; Qiuhua Zhang; Yi Sun; Wei Liu 出版日期:2023-10-01 |
| 求助人 | |
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(2025-6-4)