| 标题 |
Location-Dependent Microstructure and Mechanical Properties Evolution of TGV-Cu via an EBSD–Nanoindentation Co-Localization Characterization |
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| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Junwei Chen; Xiao Hu; Bin Yang; Chao Gu; Xuyang Yan; et al 出版日期:2026-06-18 |
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(2025-6-4)