| 标题 |
Fabrication of full preferentially oriented intermetallic compound interconnects using (111) nanotwinned Cu under bump metallization |
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| DOI | |
| 其它 |
期刊:Materials Science in Semiconductor Processing 作者:S.-N. Zhang; J. Ren; Y. Wu; M.-L. Huang 出版日期:2026-03-01 |
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(2025-6-4)