| 标题 |
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints |
| 网址 | |
| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Mardiana Said; Muhammad Firdaus Mohd Nazeri; Nurulakmal Mohd Sharif; Ahmad Azmin Mohamad 出版日期:2021-07-26 |
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(2025-6-4)