| 标题 |
Atomic-scale insights into electromigration in Cu interconnects via a new molecular dynamics approach |
| 网址 | |
| DOI | |
| 其它 |
期刊:2025 26th International Conference on Electronic Packaging Technology (ICEPT) 作者:Rui Zhang; Kunhao Tang; Jingyi Yuan; Fa Wu; Yahui Mao; Yiying Zhu 出版日期:2025 |
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(2025-6-4)