| 标题 |
Exploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography |
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| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Sari Al Zerey; Junghyun Cho; Nicholas Polomoff; Roy Yu; Katsuyuki Sakuma 出版日期:2026-05-26 |
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(2025-6-4)