| 标题 |
Evaluation of BCB Bonded and Thinned Wafer Stacks for Three-Dimensional Integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of The Electrochemical Society 作者:Yongchai Kwon; Anurag Jindal; Rod Augur; Jongwon Seok; Timothy S. Cale; et al 出版日期:2008-01-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)