| 标题 |
Planar-bond-all: A technology for three-dimensional integration of multiple packaging functions into advanced power modules |
| 网址 | |
| DOI | |
| 其它 |
期刊:2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) 作者:Zhenxian Liang 出版日期:2015-10-14 |
| 求助人 | |
| 下载 |
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(2025-6-4)