| 标题 |
Machine learning-driven optimization of the cure cycles of self-polymerizing epoxy molding compounds for semiconductor packaging applications |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composite Structures 作者:Seong Yeon Park; Dajeong Kang; Seung Yoon On; Seong Su Kim 出版日期:2025-10-25 |
| 求助人 | |
| 下载 |
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(2025-6-4)