| 标题 |
Failure envelope prediction of 2D SiCf/SiC composites based on XGBoost model |
| 网址 | |
| DOI | |
| 其它 |
期刊:Composites Part A-applied Science and Manufacturing 作者:Ben Wang; Jingyu Zhao; Zaoyang Guo; Biao Wang 出版日期:2024-06-12 |
| 求助人 | |
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(2025-6-4)