| 标题 |
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects |
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期刊:2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) 作者:K. Motoyama; D. Metzler; C. Park; N. Lanzillo; L. Zou; et al 出版日期:2023-06-24 |
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(2025-6-4)