微观结构
材料科学
合金
冶金
再结晶(地质)
晶界
滑倒
变形(气象学)
电阻率和电导率
材料的强化机理
钛合金
复合材料
机械工程
古生物学
电气工程
工程类
生物
作者
Gang’ao Xin,Meng Zhou,Jing Ke,Haoyan Hu,Zheng’ao Li,Yi Zhang,Qian Bai,Caijiao Tian,Baohong Tian,Xu Li,Alex A. Volinsky,Jin Zou
标识
DOI:10.1016/j.msea.2023.146068
摘要
High-strength Cu–Ti–Fe alloys were prepared and investigated in this study. The alloy was subjected to cold deformation and aging treatment, and revealed the transformation mechanism of the microstructure and properties. Cold deformation of 60 %, aging at 450 °C for 240 min, can optimize the hardness and conductivity of the Cu–Ti–Fe alloy. The hardness and electrical conductivity of Cu-1.5Ti-0.3Fe alloy increased from 196.8 HV to 7.8 % IACS to 269.3 HV and 19.8 % IACS after aged. Cu4Ti and Fe2Ti are the mainly precipitated phases in Cu–Ti–Fe alloy, which effectively obstructs dislocations slipping and delays recrystallization, and its the most important strengthening mechanism. The concentration of solute atoms increased could further improve the grain boundary strengthening, solution strengthening, and deformation strengthening.
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