Optical packaging of silicon photonic devices using existing microelectronic assembly infrastructure

Enabling high-throughput assembly lines for single-mode photonic packaging can dramatically improve cost and scalability of Si photonic devices. We experimentally demonstrate two solutions for photonic packaging in microelectronic tools: (a) parallelized 12-fiber assembly and (b) a 12-channel compliant polymer interface. We present the assembly processes and show -1.3dB peak optical transmission.