Development of Organosilicon Adhesive with Low Decomposition and High Temperature Resistance

A type of silicone resin adhesive was synthesized by a batch polycondensation,with dialkoxylsilane and trialkoxysilane as monomers and the ratio of R/Si as 1 to 1.2.The product was analyzed by FTIR,TGA and research on the mechanical properties.The results indicate that the adhesive has high heat resistance and little resolvent property and can compare with KR-242A to a certain degree.