The effects of surface plasma treatment on dielectric properties of polyvinylidene fluoride (PVDF) film

The effects of CF/sub 4/, O/sub 2/, and CF/sub 4/(96%)-O/sub 2/(4%) gas plasmas, following exposure for 4 and 16 min, on the dielectric properties of polyvinylidene fluoride (PVDF) films were investigated. No significant changes were observed with the exception of CF/sub 4/-O/sub 2/ plasma, where reductions in the breakdown strength ( approximately 15%), dielectric constant (6-9%), and electrical conductivity were found. Consistent with the higher content of beta phase in a clear film than in a hazy film, higher values of breakdown strength ( approximately 9%), dielectric constant (5-15%), and dissipation factor ( approximately 20%) were measured for the clear film.< >