随机森林
计算机科学
网格
随机测试
断层(地质)
分布式计算
可靠性工程
数据挖掘
人工智能
机器学习
工程类
数学
测试用例
地质学
回归分析
地震学
几何学
作者
Yuling Shang,Longlu Geng,Chunquan Li,Zhuofan Song,Jintao Zhang,Junji Li
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology
[Institute of Electrical and Electronics Engineers]
日期:2025-01-16
卷期号:15 (2): 319-327
被引量:3
标识
DOI:10.1109/tcpmt.2025.3530519
摘要
With the fast development trend of highly integrated electronic products, as the key technology of 3-D interconnect circuits, the research on monolithic intertier via (MIV) testing technology is particularly critical. Due to the high integration density, the MIV itself is very prone to manufacturing faults, moreover, the uncertainty of fault location, the complexity of fault type, that will have a greater impact on the signal transmission performance of the MIV. Therefore, in order to effectively isolate the faults and reduce the loss of assembly yield, a new nondestructive MIV fault testing method is proposed. The method adopts random forest (RF) classification model optimized based on grid search (GS) optimization algorithm. This test method can effectively solve the problem that traditional MIV test methods are difficult to accurately test for MIV faults. As well as the study of multifault in response to the fact that the existing methods are less studied for the presence of multifault in MIV. The simulation results show that the GS-RF-based MIV fault testing method can avoid damage to the MIV under testing during the MIV fault testing process, and the accuracy of single-fault testing reaches 96.11%, and the accuracy of multifault testing reaches 91.38%.
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