球栅阵列
可焊性
焊接
材料科学
冶金
锡膏
电子包装
作者
Maria Durham,Yan Liu,Andy Mackie
出处
期刊:IMAPS other content
[IMAPS - International Microelectronics Assembly and Packaging Society]
日期:2014-01-01
卷期号:2014: 000913-000929
摘要
The final step of reflowing solder spheres to solderable pads on the bottom of substrates in FCBGA, CSP, and WLCSP packages is often considered to be a trivial step. However, with the increasing co...
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