期刊:Optical Fiber Communication Conference日期:2014-01-01卷期号:: W3I.2-W3I.2被引量:44
标识
DOI:10.1364/ofc.2014.w3i.2
摘要
We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.