LED Packaging Manufacturing Technology

LED packaging technology is central to the LED manufacturing industry. For stable and consistent quality, an in-depth knowledge of LED package manufacturing technology is essential. This chapter details the LED package manufacturing technology. One of the elements of LED packaging technology is the manufacturing process. Generally, all LED packaging processes begin with a die-attach process. Wire bonding is one of the main processes for creating electrical interconnection between die and substrate. Surveillance checking is one of the keys to process control as a line of defense in the LED manufacturing process. The encapsulation process is one of the most important processes in the LED packaging technology. There are many types of LED defects in the LED packaging industry. The chapter discusses some of the common defects and their impact on the electro-optical properties of LEDs.