中间层
地平面
互连
电子工程
信号完整性
布线(电子设计自动化)
频道(广播)
电容
电容感应
球栅阵列
带宽(计算)
计算机科学
电气工程
工程类
材料科学
电信
物理
焊接
蚀刻(微加工)
电极
图层(电子)
量子力学
天线(收音机)
复合材料
作者
Srikrishna Sitaraman,Steven Verhaverbeke,Samer Banna,Mukhles Sowwan,Liu Jiang,El Mehdi Bazizi,Buvna Ayyagari-Sangamalli
标识
DOI:10.1109/ectc51906.2022.00212
摘要
This paper systematically analyzes the impact of various physical design parameters on the electrical performance and optimizes the digital channel on a 2.5D organic interposer. The analysis focusses on mapping the impact of design parameters such as line width, spacing, dielectric thickness, metal thickness, presence of ground plane, and routing configuration on the bandwidth performance of the interconnect channel. It was observed that, while the cross-section of an interconnect played a role in the resistance, there are instances when the capacitive and inductive crosstalk and return-path coupling overshadow the benefits of a larger cross-section area. Further, Ground Signal Ground (GSG) routing configuration that seems less efficient, has been shown to offer performance gains and improved routing density over standard microstrip line (MSL). It has also been validated that, depending on the routing configuration, parameters such as the dielectric thickness or the presence of a ground plane may not have any impact on the performance; and hence offer additional freedom in terms of design and cost. Finally, optimization of a 2.5D interposer channel using GSG configuration has been presented.
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