A Novel Antioxidation Treatment Method for Micron/Nano Copper Materials in Semiconduct Field

Micro-nano copper powder is the potential interconnect materials of application in the third generation of high-power semiconductor devices, micro-nano copper powder, but easy to be oxidized in the air environment, this feature will seriously affect the widely use of micro nano copper powder and the interconnection reliability after sintering. Therefore, there is an urgent need to find a method that can effectively improve the oxidation resistance and sintering performance of micro-nano copper powder. In this paper, a novel method for the treatment of micro-nano copper powder was proposed, in which the surface oxide of micro-nano copper powder was first rinsed, followed by the addition of imidazole compounds ethanol solution, which was stirred continuously at 60°C for 10 minutes to make the imidazole compounds fully react with micro-nano copper powder. The XRD test of the obtained micro-nano copper powder found that the treated micro-nano copper powder did not appear to oxidize significantly after being left in an air environment for 30 days. After sintering of micro-nano copper powder, the shear test found that the maximum shear strength reached 42.31MPa, which has good shear characteristics.