Transimpedance amplifier-hybrid integrated miniature silicon photonic fiber optic gyroscope module for high-precision inertial navigation

To address the miniaturization requirements of fiber optic gyroscope (FOG) modules, in this work, we propose an optoelectronic architecture based on hybrid integration and packaging. By co-packaging the transimpedance amplifier (TIA) circuit with silicon photonic FOG chip in an industry-standard 14-pin butterfly package. The module comprises three key subsystems: optics, electronics, and thermal management. The multifunctional optical subsystem is composed of a hybrid integrated chip which functions simultaneously as a light source, polarizer, power splitter, as well as photodetector. The electronic subsystem acts as a pre-amplifier by integrating a low-noise TIA circuit with customizable transimpedance. Thermal management combines thermoelectric coolers (TECs) and negative temperature coefficient (NTC) sensors.The FOG test shows the 10 s smooth bias stability is 0.0995 °/h. The results are slightly better than the FOG with discrete counterpart. Our work provides a scalable solution for high-precision inertial navigation systems, demonstrating significant potential for cost-effective mass production in aerospace, autonomous vehicles, and industrial robotics applications.