Automotive Semiconductor Test: Challenges and Solutions towards Zero Defect Quality

In this invited paper, we provide an overview of the challenges and solutions to ensure Zero Defect (ZD) quality for the automotive semiconductor products from test viewpoint. We start with an overview of the defect classification and acceleration of latent defect, followed by review of recent developments of automotive semiconductor test. Next we present an overview of automotive production test flow and discuss the increased Electrical Over Stress (EOS) risk associated with Package-Level Burn-In (PLBI) and the recent work on reducing the risk using Wafer Level Stress for automotive semiconductors. Moreover, we will provide an in-depth review of the key advanced stress and test components including the enhanced High Voltage Stress Test (HVST) and enhanced Advanced Outlier Limits (AOL) screening and the enabling Design for ZD methodology, as well as their implication to EOS/ESD community.