方向错误
电子背散射衍射
材料科学
晶界
微晶
方向(向量空间)
微观结构
冶金
几何学
数学
标识
DOI:10.1179/174328406x130876
摘要
Automated electron backscatter diffraction (EBSD) or orientation imaging microscopy (OIM) has become a common analytical tool for the statistical characterisation of grain boundaries in polycrystalline materials. However, as such studies have become more tractable with the advances in EBSD technology some critical complexities of grain boundary analysis have been neglected. This includes the multidimensionality of grain boundaries, correlated versus uncorrelated misorientation distributions, OIM scanning artefacts specifically critical to boundary analysis. The present work describes some of these shortfalls as well as approaches for mitigating problems in grain boundary analysis via EBSD.
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