Next-generation BGA Techndogy

Next-generation BGA such as Slightly Larger than IC Carrier(SLICC),Mini Ball Grid Ar- ray(mBGA),Micro Ball Grid Array(μBGA),Chip Scale Package(CSP),Super Ball Grid Array(Super BGA)and Field Programmable Interconnect Device(FPID)have mainly been presented in this article. Even smaller in dimentions.Lower in cost,much better in electrical performance and in heat sink are some of their characteristics.