A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control

With the recent increasing interest in big data and artificial intelligence, there is an emerging demand for high-performance memory system with large density and high data-bandwidth. However, conventional DIMM-type memory has difficulty achieving more than 50GB/s due to its limited pin count and signal integrity issues. High-bandwidth memory (HBM) DRAM, with TSV technology and wide IOs, is a prominent solution to this problem, but it still has many limitations: including power consumption and reliability. This paper presents a power-efficient structure of TSVs with reliability and a cost-effective HBM DRAM core architecture.