期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology [Institute of Electrical and Electronics Engineers] 日期:2025-04-15卷期号:15 (11): 2331-2343被引量:11
标识
DOI:10.1109/tcpmt.2025.3561039
摘要
This article addresses the critical challenges of chiplet placement and routing optimization in the era of advanced packaging and heterogeneous integration. We present a novel approach that formulates the problem as a signal integrity-aware hierarchical Markov decision process (MDP), leveraging the place-to-route (P2R) algorithm. Our method uniquely incorporates the universal chiplet interconnect express (UCIe) eye mask specifications to ensure compliance with datarate-dependent signal integrity requirements. Tested on 10 benchmark problems, P2R achieved superior results with an average eye-diagram aperture of 0.869 unit interval (UI) in a single iteration, outperforming random search and deep reinforcement learning by 44.8%. By addressing the combinatorial complexity and hard constraints inherent in chiplet-based designs, this approach enables optimization while ensuring compliance with industry standards. Our work represents a significant advancement in optimizing heterogeneous integrated systems, addressing challenges that conventional placement and routing methods cannot adequately solve.