Present Situation and Development Trend of Potting Materials Using in Electron Device

This paper introduces the kinds of potting materials for electron devices.It elaborates the component,properties,application status,existing problems and method to improve the properties of epoxy potting materials and organic-silicon potting materials.One analyzes the defects of the traditional potting materials and points out the goal and meaning to investigate the insulating heat conduction materials.It uses organic-silicon and inorganic filling AlN powders to fabricate the compound materials.One points out the development trend of potting materials for electron device.