纳米片
兴奋剂
材料科学
氢
纳米技术
化学工程
化学
光电子学
有机化学
工程类
作者
Lingjie Kong,Ya-Meng Xie,Xingyu Chen,Cong Xi,Fei-Fei Zhang,Min Wang,Long Shang,Yuan Huang,Xi‐Wen Du,Sergei A. Kulinich
摘要
A zinc-infiltration process was adopted to prepare silver-doped copper nanosheet arrays. The larger atomic radius of Ag introduces tensile stress, which lowers the electron density at the s-orbitals of Cu atoms and improves the adsorption capability for hydrogen atoms. As a catalyst for hydrogen evolution, these silver doped copper nanosheet arrays achieved a low overpotential of 103 mV at 10 mA cm-2 in 1 M KOH, which is 604 mV lower than that of pure copper foil.
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