多路复用器
多路复用
炸薯条
光子学
波分复用
材料科学
光电子学
时分复用
电子工程
计算机科学
电信
工程类
波长
作者
Yuanjian Wan,Xiaoping Cao,Chengkun Cai,Kang Li,Min Yang,Guofeng Yan,Weike Zhao,Yingying Peng,Yaocheng Shi,Daoxin Dai,Jian Wang
标识
DOI:10.1002/lpor.202300853
摘要
Abstract Multidimensional multiplexing technologies have been proven to be a promising scheme to meet the demands of high‐capacity optical interconnects and optical processing networks. However, challenges remain to realize multidimensional hybrid multiplexing data transmission and signal processing between few‐mode fiber transmission links and on‐chip optical processing networks, since the optical coupling between fiber and chip is almost exclusively in the single‐mode regime. Here, a multidimensional fiber‐to‐chip optical processing system is proposed and demonstrated for hybrid wavelength‐, mode‐, and polarization‐division multiplexing signals, where multidimensional coupling between few‐mode fiber transmission link and on‐chip multi‐mode processing network is realized by using a 3D photonic integrated (de)multiplexers on a glass chip as well as 2D photonic integrated (de)multiplexers on a silicon chip, and the on‐chip multidimensional optical processing network composed by parallel cascaded micro‐ring resonator array performs a function of reconfigurable optical add/drop multiplexer. By operating wavelength‐division multiplexing in conjunction with mode‐division multiplexing and polarization‐division multiplexing, the communication bandwidth of fiber‐to‐chip optical processing systems can be further scaled.
科研通智能强力驱动
Strongly Powered by AbleSci AI