材料科学
焊接
复合材料
温度循环
接头(建筑物)
扩散焊
箔法
电极
太阳能电池
结构工程
光电子学
热的
气象学
物理化学
工程类
化学
物理
作者
Yuhan Ding,Zhichao Wang,Jusha Ma,Chen Shen,Nannan Chen,Xunchun Wang,Kanglong Wu,Lin Wang,Yan Cai,Bin Qian,Xueming Hua
标识
DOI:10.1016/j.matdes.2023.112150
摘要
When space solar cell array is subjected to harsh temperature cycle, such as planet orbit, thermal fatigue cracks in bonding area are easily induced. With the aim of improving bonding quality and elucidating failure mechanism of parallel gap resistance welding (PGRW) joints in temperature cycling environment, the present research investigates the effect of current density on bonding quality and thermal fatigue behavior of PGRW joint between Ag interconnector and front electrode of GaAs solar cell. When current density is set at 417 A/mm2, a solid diffusion bonding is achieved at the Ag/Au interface, which also possesses adequate joint strength as ensured by both pressure and input energy of PGRW. Crack initiation by thermal fatigue is found at joint edge, which subsequently propagates along the interface as the environment temperature cycling continues. Further investigation reveals that the conducted temperature cycling generates serious tensile and compressive stress in the multi-layered joint structure. Since such reciprocating forces directly induce micro-plastic deformation and strain accumulation at joint interface, failure by crack is finally generated at the joining interface.
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