Design of Diamond Cooling Chip for Thermal Management of Chiplet-Based System

Chiplet technology offers modularity and heterogeneous integration, enhancing design flexibility while lowering manufacturing costs and risks. However, increasing integration density leads to higher heat flux, posing critical thermal management challenges. This study proposes a novel diamond-based cooling solution that combines microchannel and microjet cooling to address these issues effectively. A diamond cooling chip was developed using numerical simulations, featuring a diamond substrate bonded to the chip surface with nano-silver gel. Microchannels and microjet inlets were etched into the substrate to enable dual-stage cooling: direct impingement on the chip surface and secondary cooling of sidewalls. Structural parameters were systematically optimized to enhance performance. Simulation results show that under a 100 W heat load, the maximum chip temperature is reduced to 318.4 K—a 36.6 °C drop compared to microchannel-only designs. The secondary microjet system also improves temperature uniformity, reducing variance by 20.7%. Further optimization yields a 4 °C decrease in peak temperature, temperature variance of 2.435, and a 19.7% reduction in thermal resistance. These findings demonstrate the proposed cooling chip’s effectiveness in managing heat dissipation, enhancing temperature uniformity, and lowering thermal resistance in high-power chiplet systems.