Development of Heat-Resistant UV-Curable Dicing Tape

In the semiconductor manufacturing process, the demand for high performance materials has increased significantly. As the industry progresses, demand is increasing for a single piece of tape to handle various processes in succession. These processes include surface treatment (plasma processing, CVD, metal film formation, insulating and film processing), thermosetting in resin encapsulation, annealing, drying, probe testing, and others. We have developed a UVcurable dicing tape with heat resistance. The use of the tape allows for removal with low adhesion and less adhesive residue, even after exposure to high-temperature processes. The developed tape can simplify the semiconductor manufacturing process and dramatically increase productivity. The heatresistant UV-curable dicing tape offers new possibilities for innovative semiconductor manufacturing.