Design and Manufacturing of Double-Sided SiP Power Modules via Temporary Carrier-Based Process

This study presents a co-design methodology for high-density double-sided system-in-package (DS-SiP) power modules, combining a novel temporary carrier-based reconstitution process with multi-objective optimization to simultaneously address warpage control and thermo-mechanical reliability. The proposed approach decouples double-sided molding into sequential single-side steps, effectively eliminating strip substrate warpage after the first molding cycle and minimizing process-induced stress. A high-fidelity finite element model was developed to simulate thermo-mechanical behavior and identify critical stress locations at die/EMC and die/adhesive interfaces. The package architecture was optimized using Taguchi-Grey relational analysis, revealing molding material selection as the most influential factor. A test vehicle was successfully fabricated, incorporating through-mold vias (TMVs) and 3D component-on-package (CoP) integration. Reliability tests confirmed strong performance under thermal and humidity stresses, with failure analysis validating simulation predictions of interfacial delamination as the dominant failure mechanism. This work provides a scalable and cost-effective framework for developing robust DS-SiP power modules with improved power density and reliability.