Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate

A β-Ga 2 O 3 film was directly bonded with a diamond heat spreader for efficient heat dissipation. Ga 2 O 3 is expected as a future material for power electronics, but it has a heat dissipation problem due to its low thermal conductivity. We demonstrated that thermal resistance could be improved by direct bonding with a diamond heat spreader.