薄脆饼
废品
计算机科学
实时计算
嵌入式系统
工艺工程
材料科学
工程类
光电子学
冶金
作者
Zheng Zou,Seng Keat Lim
出处
期刊:Advanced Semiconductor Manufacturing Conference
日期:2021-05-10
卷期号:: 1-4
被引量:2
标识
DOI:10.1109/asmc51741.2021.9435724
摘要
A new method is proposed to effectively monitor CD SEM measurement tool's focusing performance and fine shift level, by using a proprietary computer program to constantly analyze in real time the SEM images obtained during normal inline measurements on production wafers. Thus, a deterioration in measurement tool performance may be detected at an early stage to avoid potential large quantity wafer scrap arising from erroneous measurements.
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