动力循环
材料科学
可靠性(半导体)
MOSFET
温度循环
降级(电信)
栅氧化层
失效机理
拓扑(电路)
可靠性工程
功率(物理)
计算机科学
电气工程
晶体管
电压
工程类
复合材料
热力学
热的
物理
作者
Mei Wang,Yuan Chen,Zhiyuan He,Zhaohui Wu,Bin Li
标识
DOI:10.1109/tpel.2023.3257885
摘要
Power cycling test (PCT) is an effective method to evaluate the SiC mosfet s' long-term reliability, including lifetime and degradation mechanisms. Some of the aging precursors of PCT have been identified in the previous literature. But when multiple failure mechanisms compete with each other, the individual precursors are nullified. Although PCT is mainly used to evaluate the package reliability, there are still unresolved problems due to the gate oxide reliability of SiC mosfet , and the repeated gate stress of the power cycling has different effects on the devices with different gate structures. This article presents a comprehensive investigation of the aging precursors and failure mechanism of three typical commercial SiC mosfet s with different gate structures through PCTs under two different conduction modes. Degradation-related essential precursors and possible causes behind them are discussed. The failure mechanisms and correlation with the degradation state of different devices are studied in depth. In addition, the effects of PCT under different conduction modes on failure mechanism and lifetime have been investigated.
科研通智能强力驱动
Strongly Powered by AbleSci AI