材料科学
热导率
热的
热膨胀
热接触电导
热阻
热传导
复合材料
热发射率
热力学
物理
作者
G. Ventura,Giovanni Bianchini,E. Gottardi,I. Peroni,Andrea Peruzzi
出处
期刊:Cryogenics
[Elsevier BV]
日期:1999-05-01
卷期号:39 (5): 481-484
被引量:41
标识
DOI:10.1016/s0011-2275(99)00051-x
摘要
We measured the expansion coefficient of Torlon 4203 (polyamide-imide) as a function of temperature between 4.2 and 295 K. The thermal expansion is lower than that of most polymers. The thermal conductivity k between 0.1 and 5 K was also measured: below 1 K, a quadratic dependence on temperature of k was found, as predicted by the tunnelling model, while the behaviour shown by our data above 1 K suggests the presence of a plateau.
科研通智能强力驱动
Strongly Powered by AbleSci AI