Highly robust SiCOH/mesoporous SiO2 ultralow dielectric films with heterostructures

We report here a new dual-coating method for the deposition of SiCOH (elementally descriptive but not representing the stoichiometry) ATMS (allyltrimethylsilane) low-k films on mesoporous SiO₂ (SBA-15)/PEG (polyethylene glycol) composite films to improve the dielectric constant and mechanical properties of SiCOH/SBA-15 dual forms.